PE-75 Plasma Asher
 
 
 
 

The PE-75 is our most popular system for use as a plasma asher. Although all of our systems are versatile and can perform many tasks without changing configuration settings, the PE-75 is the best value in the industry for plasma ashing semiconductor wafers.

Plasma ashing is the process of removing photoresist from an etched wafer. Ashing is performed with fluorine or oxygen and is almost always used with a single gas plasma. The versatile PE-75 comes with two gases installed for other cleaning and ashing purposes.

The PE-75 is an entry level plasma treatment system. It's a feature packed, low cost, and robust machine that is perfect for production facilities, research labs, universities, medical facilities, or any industry which needs a small-scale, cost-effective plasma ashing solution. It has all the features of the PE-50 XL but also features a larger chamber size for larger processing applications.

This unit excels at plasma cleaning and surface modification as well as use as a plasma asher.

The PE-75 may also be used in preparing asbestos specimens as a low temperature plasma treatment.

If you are looking for a fully automated solution, our PE-75 Venus plasma asher combines the high value of the PE-75 with fully automated processing. The Venus includes the same laptop control found on our larger systems.

 
 
Specification

Electrode Configuration One or Two Horizontal (9"Wx10"D)
Generator 200W 20-80KHz Auto Frequency Tuning With Adjustable Pulsing Rate
Gas Control Two 0-25cc/min Rotometers with Precision Needle Valves
Vacuum Gauge 1-2000 mT
Vacuum Pump 5CFM 2-Stage Direct Drive Oil Pump (Oxygen Service – Krytox Charged)
Control System PLC-Based Keypad Input System with Alphanumeric Display; Stores One Recipe for Automatic Process Sequencing
Chamber Material 6061-T6 Aluminum
Chamber Dimensions 10.75” Deep x 10” Round
Electrical Requirement 120VAC / 60Hz @ 15A or 220VAC / 50Hz @ 14A
Unit Dimensions 18"x19"x24"
Unit Weight 90lbs
Vacuum Pump Weight 35lbs
 
 
Optional Features

Temperature Control System
To maintain specific temperatures in the processing chamber for enhanced uniformity and application-specific needs

MHz Power Supplies with Automatic Matching Network
Higher watt/frequency power supplies

PC-based Control System
For fully automatic system control, multi-step process sequencing, multiple recipe storage, data logging/trending, events/alarms, etc.

Dry Vacuum Pump
For more control over the process chamber pressure

Chamber and Vacuum Pump Purge Systems / Air Dryer / Purge Gas Generator
To ensure thorough removal of contaminants from operating equipment, providing uniformity and increasing longevity

Additional Gas Inputs/Rotometers
Allows for more complex process gas combinations

Digital Mass Flow Controllers
Provides digital automation and monitoring of process gases

Light Tower
For easy visualization of the steps of the plasma processing sequence

 
 
Download

PE-75 Datasheet

Download