Most systems can be customized with a wide range of options including:
Custom Sized Vacuum Chamber, Number/Size of Electrodes
To ensure your system is able to specifically meet your throughput requirements
Reactive Ion Electrodes
Enables reactive ion etching
MHz Power Supplies with Automatic Matching Network
Higher watt/frequency power supplies
Electrostatic Shielding
Significantly increases process uniformity by eliminating excess etching at the outer bounds of the processed material
Temperature Control System
To maintain specific temperatures in the processing chamber for enhanced uniformity and application-specific needs
Dry Vacuum Pump
For more control over the process chamber pressure
Chamber and Vacuum Pump Purge Systems / Air Dryer / Purge Gas Generator
To ensure thorough removal of contaminants from operating equipment, providing uniformity and increasing longevity
Vacuum Pump Oil Mist Eliminator
Captures oil from vacuum pump exhaust
Vacuum Pump Oil Filtration
Filters the vacuum pump oil down to a 3 micron level, increasing the longevity of the oil and the vacuum pump
Automatic Vacuum Control
Provides automation of the process chamber pressure
Additional Digital Mass Flow Controllers
Provides digital automation and monitoring of process gases
Software Configurable Gas Steering Matrix
Designed to allow for up to 5 process gas inputs with 3 selectable at any time
Low Gas-Source Alarm
Notification for when your process gas container needs replenished
Light Tower
For easy visualization of the steps of the plasma processing sequence
Fume Scrubber
To eliminate hazardous fumes/contaminants from the chamber/vacuum pump exhaust |